The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2025
Filed:
Apr. 23, 2024
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Shu-Shen Yeh, Taoyuan, TW;
Po-Yao Lin, Hsinchu County, TW;
Hui-Chang Yu, Hsinchu County, TW;
Shyue-Ter Leu, Hsinchu, TW;
Shin-Puu Jeng, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
A semiconductor device includes a first semiconductor die, a second semiconductor die and a package lid. The package lid is disposed over the first semiconductor die and the second semiconductor die. The package lid includes a roof and an island. The roof extends along a first direction and a second direction perpendicular to the first direction and includes a first portion and a second portion. The island protrudes from the first portion of the roof, wherein the island covers and is thermally connected to the first semiconductor die, and the second portion of the roof covers and is physically separated from the second semiconductor die.