The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 08, 2025

Filed:

Jul. 31, 2023
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Fu-Ting Sung, Yangmei, TW;

Chung-Chiang Min, Zhubei, TW;

Yuan-Tai Tseng, Zhubei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10B 63/00 (2023.01); G11C 5/06 (2006.01); G11C 13/00 (2006.01); H10B 63/10 (2023.01); H10N 70/00 (2023.01); H10N 70/20 (2023.01);
U.S. Cl.
CPC ...
G11C 5/06 (2013.01); G11C 13/0011 (2013.01); H10B 63/10 (2023.02); H10N 70/245 (2023.02); H10N 70/823 (2023.02);
Abstract

Some embodiments relate to an integrated chip having a bottom dielectric layer overlying a conductive wire. A bottom electrode is disposed within the bottom dielectric layer. A data storage layer overlies the bottom electrode. A top electrode overlies the data storage layer. A top surface of the top electrode is disposed below a top surface of the data storage layer.


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