The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2025
Filed:
Sep. 18, 2020
Intel Corporation, Santa Clara, CA (US);
Adel A. Elsherbini, Tempe, AZ (US);
Mohammad Enamul Kabir, Portland, OR (US);
Zhiguo Qian, Chandler, AZ (US);
Gerald S. Pasdast, San Jose, CA (US);
Kimin Jun, Portland, OR (US);
Shawna M. Liff, Scottsdale, AZ (US);
Johanna M. Swan, Scottsdale, AZ (US);
Aleksandar Aleksov, Chandler, AZ (US);
Feras Eid, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Disclosed herein are capacitors and resistors at direct bonding interfaces in microelectronic assemblies, as well as related structures and techniques. For example, in some embodiments, a microelectronic assembly may include a first microelectronic component and a second microelectronic component, wherein a direct bonding interface of the second microelectronic component is direct bonded to a direct bonding interface of the first microelectronic component, the microelectronic assembly includes a sensor, the sensor includes a first sensor plate and a second sensor plate, the first sensor plate is at the direct bonding interface of the first microelectronic component, and the second sensor plate is at the direct bonding interface of the second microelectronic component.