The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 11, 2025

Filed:

Dec. 06, 2022
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

David Michael Audette, Colchester, VT (US);

Grant Wagner, Jericho, VT (US);

Peter William Neff, Cambridge, VT (US);

Jacob Louis Moore, Milton, VT (US);

Melissa Keefe, Cortlandt Manor, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 1/067 (2006.01); G01R 1/073 (2006.01);
U.S. Cl.
CPC ...
G01R 1/067 (2013.01); G01R 1/07342 (2013.01);
Abstract

An IC device test probe has one or more clusters of a plurality of tapered probe tips that taper upon a taper plane that is orthogonal to a seating direction or force vector of the IC device test probe toward the IC device. Each of the plurality of tapered probe tips is seated against one contact of the IC device. In this manner, the IC device test probe is seated against multiple contacts and may therefore apply test signal(s) to these contacts serially, simultaneously, or the like. The IC device test probe allows the seating to small pitch IC devices and associated testing thereof. This allows for electrical characterization of the IC device by the same test signal(s) through the IC device test probe and ultimately through multiple contacts. The forces associated with seating the IC device test probe against the IC device contacts is effectively spread across multiple contacts.


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