The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 04, 2025

Filed:

Jun. 30, 2022
Applicants:

Global Unichip Corporation, Hsinchu, TW;

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Chih-Chieh Liao, Hsinchu, TW;

Yu-Min Sun, Hsinchu, TW;

Chih-Feng Cheng, Hsinchu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01H 85/02 (2006.01); G01R 1/073 (2006.01); G01R 1/36 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H01H 85/0241 (2013.01); G01R 1/07342 (2013.01); G01R 1/36 (2013.01); H05K 1/112 (2013.01); H01H 2085/0275 (2013.01);
Abstract

A probe card device includes a wiring board provided with a plurality of contacts, a probe head having a probe holder and a plurality of conductive probes arranged on the probe holder, respectively, and a circuit protection assembly including an insulation plate, a plurality of through holes and a plurality of self-resetting fusing elements. The insulation plate is sandwiched between the wiring board and the probe head. The through holes are respectively formed on the insulation plate and arranged in an array form. The self-resetting fusing elements are respectively disposed within the through holes. Each of the self-resetting fusing elements is electrically connected to one of the contacts and one of the conductive probes for reversibly breaking down electric currents from the wiring board to the conductive probe.


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