The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2025

Filed:

Jan. 23, 2024
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Nobuhiko Mouri, Kumamoto, JP;

Takanori Obaru, Kumamoto, JP;

Yasushi Takiguchi, Kumamoto, JP;

Teruhiko Kodama, Kumamoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); B08B 1/10 (2024.01); B08B 1/32 (2024.01); B24B 37/10 (2012.01); B24B 37/30 (2012.01); H01L 21/02 (2006.01); H01L 21/304 (2006.01); H01L 21/677 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67046 (2013.01); B08B 1/10 (2024.01); B08B 1/32 (2024.01); B24B 37/107 (2013.01); B24B 37/30 (2013.01); H01L 21/0209 (2013.01); H01L 21/304 (2013.01); H01L 21/67028 (2013.01); H01L 21/67051 (2013.01); H01L 21/67748 (2013.01); H01L 21/68728 (2013.01); H01L 21/68742 (2013.01);
Abstract

A substrate processing method includes: performing a both-surface cleaning processing in which a first cleaning body, which ejects the fluid to the one surface or is brought into contact with the one surface, and subsequently moves both the first cleaning body and a second cleaning body, which is in contact with the remaining surface of the upper surface and the lower surface of the substrate and rotated around a first vertical axis, horizontally in synchronization with each other toward an outer peripheral portion of the substrate, and performing a side end cleaning processing in which a third cleaning body is rotated around a second vertical axis and brought into contact with the side end of the substrate to clean the side end of the substrate while simultaneously performing the both-surface cleaning processing.


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