The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2025

Filed:

Jul. 25, 2022
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Yi-Tse Hung, Hsinchu, TW;

Chao-Ching Cheng, Hsinchu, TW;

Tse-An Chen, Taoyuan, TW;

Hung-Li Chiang, Taipei, TW;

Tzu-Chiang Chen, Hsinchu, TW;

Lain-Jong Li, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 29/76 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7606 (2013.01); H01L 29/66431 (2013.01); H01L 29/66787 (2013.01); H01L 29/785 (2013.01);
Abstract

A method includes: forming a dielectric fin protruding above a substrate; forming a channel layer over an upper surface of the dielectric fin and along first sidewalls of the dielectric fin, the channel layer including a low dimensional material; forming a gate structure over the channel layer; forming metal source/drain regions on opposing sides of the gate structure; forming a channel enhancement layer over the channel layer; and forming a passivation layer over the gate structure, the metal source/drain regions, and the channel enhancement layer.


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