The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2025

Filed:

Mar. 29, 2021
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Eric Chin Hong Ng, Milpitas, CA (US);

Edward Wibowo Budiarto, Fremont, CA (US);

Mehdi Vaez-Iravani, Los Gatos, CA (US);

Todd Jonathan Egan, Fremont, CA (US);

Venkatakaushik Voleti, Cupertino, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); G01B 11/06 (2006.01); G06N 5/04 (2023.01); G06N 20/00 (2019.01);
U.S. Cl.
CPC ...
H01L 21/67253 (2013.01); G01B 11/06 (2013.01); G06N 5/04 (2013.01); G06N 20/00 (2019.01); G01B 2210/56 (2013.01);
Abstract

A method includes identifying first structure data of a first region of a substrate and receiving optical metrology data of the substrate associated with one or more substrate deposition processes in a processing chamber. The method further includes determining, based on the optical metrology data and the first structure data, a first growth rate of the first region of the substrate associated with the one or more substrate deposition processes. The method further includes predicting, based on the optical metrology data and the first growth rate, thickness data of a second region of the substrate without second structure data of the second region.


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