The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 21, 2025

Filed:

Feb. 19, 2024
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Mitsuru Miyazaki, Tokyo, JP;

Tomoaki Fujimoto, Tokyo, JP;

Koichi Fukaya, Tokyo, JP;

Fumitoshi Oikawa, Tokyo, JP;

Takuya Inoue, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); B08B 1/32 (2024.01); B08B 3/02 (2006.01); B24B 7/22 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67051 (2013.01); B08B 1/32 (2024.01); B08B 3/024 (2013.01); B24B 7/228 (2013.01); H01L 21/67046 (2013.01); H01L 21/6719 (2013.01); H01L 21/67219 (2013.01); H01L 21/67253 (2013.01); H01L 21/68764 (2013.01);
Abstract

A cleaning apparatus includes: a cleaning tank that defines a cleaning space for cleaning a wafer; a wafer rotation mechanism that is arranged inside the cleaning tank and holds and rotates the wafer; a cleaning member that contacts and cleans a surface of the wafer, is rotatable around a central axis extending in a lateral direction, and has a length in an axial direction longer than a radius of the wafer; a swing mechanism that swings the cleaning member around a swing axis located inside the cleaning tank to move the cleaning member from a retracted position outside of the wafer to a cleaning position directly above the wafer; a second cleaning means that cleans the surface of the wafer; and a second swing mechanism that swings the second cleaning means around a second swing axis located inside the cleaning tank to pass directly above a center of the wafer.


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