IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12199018 B1

PDFFull Text
Date of Patent:
Jan. 14, 2025

Filed:

Sep. 18, 2020

Direct bonding in microelectronic assemblies

Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Adel A. Elsherbini, Tempe, AZ (US);

Krishna Bharath, Phoenix, AZ (US);

Han Wui Then, Portland, OR (US);

Kimin Jun, Portland, OR (US);

Aleksandar Aleksov, Chandler, AZ (US);

Mohammad Enamul Kabir, Portland, OR (US);

Shawna M. Liff, Scottsdale, AZ (US);

Johanna M. Swan, Scottsdale, AZ (US);

Feras Eid, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:

Akona IP PC

Primary Examiner:

David A Zarneke

Int. Cl.
CPC ...
H01L 23/49 (2006.01); H01L 23/00 (2006.01); H01L 23/532 (2006.01); H01L 23/538 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49 (2013.01); H01L 23/53228 (2013.01); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01); H01L 24/80 (2013.01); H05K 1/11 (2013.01); H01L 2224/0812 (2013.01); H01L 2224/80001 (2013.01); H01L 2224/80895 (2013.01);
Abstract

Disclosed herein are microelectronic assemblies including direct bonding, as well as related structures and techniques. For example, in some embodiments, a microelectronic assembly may include a first microelectronic component and a second microelectronic component coupled to the first microelectronic component by a direct bonding region, wherein the direct bonding region includes a first subregion and a second subregion, and the first subregion has a greater metal density than the second subregion. In some embodiments, a microelectronic assembly may include a first microelectronic component and a second microelectronic component coupled to the first microelectronic component by a direct bonding region, wherein the direct bonding region includes a first metal contact and a second metal contact, the first metal contact has a larger area than the second metal contact, and the first metal contact is electrically coupled to a power/ground plane of the first microelectronic component.

Find Patent Forward Citations

Loading…