The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2024
Filed:
Aug. 04, 2022
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Szu-Ying Chen, Toufen Township, TW;
Min-Feng Kao, Chiayi, TW;
Jen-Cheng Liu, Hsin-Chu, TW;
Feng-Chi Hung, Chu-Bei, TW;
Dun-Nian Yaung, Taipei, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
The present disclosure relates to a method of forming an integrated chip. The method includes forming a gate stack over a front surface of a substrate. A mask layer is formed over at least a portion of the gate stack and a portion of the front surface. A plurality of dopants are implanted into one or more regions of the substrate that are not covered by the mask layer to form one or more doped isolation features in the substrate. The one or more doped isolation features are formed to have a convex portion at least partially under the gate stack.