The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2024
Filed:
Jul. 22, 2021
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Min-Feng Kao, Chiayi, TW;
Dun-Nian Yaung, Taipei, TW;
Jen-Cheng Liu, Hsin-Chu, TW;
Hsun-Ying Huang, Tainan, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
In some embodiments, the present disclosure relates to an integrated chip. The integrated chip includes a first plurality of interconnects within a first inter-level dielectric (ILD) structure disposed along a first side of a first substrate. A conductive pad is arranged along a second side of the first substrate. A first through-substrate-via (TSV) physically contacts an interconnect of the first plurality of interconnects and a first surface of the conductive pad. A second plurality of interconnects are within a second ILD structure disposed on a second substrate. A second TSV extends from an interconnect of the second plurality of interconnects to through the second substrate. A conductive bump is arranged on a second surface of the conductive pad opposing the first surface. The second TSV has a greater width than the first TSV.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile