The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2024

Filed:

Mar. 07, 2023
Applicants:

Global Unichip Corporation, Hsinchu, TW;

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Chih-Chieh Liao, Hsinchu, TW;

Yu-Min Sun, Hsinchu, TW;

Chih-Feng Cheng, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/26 (2020.01); G01R 1/067 (2006.01); G01R 1/073 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2601 (2013.01); G01R 1/06722 (2013.01); G01R 1/07314 (2013.01); G01R 1/07357 (2013.01);
Abstract

A testing apparatus includes a circuit board, a probe station and a probe array. The circuit board includes a plurality of contacts. The probe station includes a platform located on the circuit board and used for carrying a device under test (DUT), and a plurality of probe holes formed on the platform and arranged in an array. The probe array includes a plurality of telescopic probes respectively linearly inserted into the probe holes. One end of each of the telescopic probes is contacted with one of the contacts, and the other end thereof is contacted with one of solder balls of the DUT. Each of the probe holes includes an elongated groove penetrating through the platform. Each of the telescopic probes is provided with a fin protruding outwardly and inserting into the elongated groove.


Find Patent Forward Citations

Loading…