The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2024
Filed:
May. 14, 2020
Adeia Semiconductor Bonding Technologies Inc., San Jose, CA (US);
Belgacem Haba, Saratoga, CA (US);
Laura Wills Mirkarimi, Sunol, CA (US);
Javier A. DeLaCruz, San Jose, CA (US);
Rajesh Katkar, Milpitas, CA (US);
Cyprian Emeka Uzoh, San Jose, CA (US);
Guilian Gao, San Jose, CA (US);
Thomas Workman, San Jose, CA (US);
ADEIA Semiconductor Bonding Technologies Inc., San Jose, CA (US);
Abstract
A bonded structure can comprise a first element and a second element. The first element has a first dielectric layer including a first bonding surface and at least one first side surface of the first element. The second element has a second dielectric layer including a second bonding surface and at least one second side surface of the second element. The second bonding surface of the second element is directly bonded to the first bonding surface of the first element without an adhesive.