The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2024
Filed:
Sep. 18, 2020
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Aleksandar Aleksov, Chandler, AZ (US);
Adel A. Elsherbini, Tempe, AZ (US);
Shawna M. Liff, Scottsdale, AZ (US);
Johanna M. Swan, Scottsdale, AZ (US);
Feras Eid, Chandler, AZ (US);
Randy B. Osborne, Beaverton, OR (US);
Van H. Le, Beaverton, OR (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 23/49 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 23/5384 (2013.01); H01L 23/49 (2013.01); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01); H01L 25/0657 (2013.01);
Abstract
Disclosed herein are microelectronic assemblies including microelectronic components that are coupled together by direct bonding, as well as related structures and techniques. For example, in some embodiments, a microelectronic assembly may include an interposer, including an organic dielectric material, and a microelectronic component coupled to the interposer by direct bonding.