The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2024
Filed:
Apr. 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Shin-Puu Jeng, Hsinchu County, TW;
Po-Hao Tsai, Taoyuan, TW;
Po-Yao Chuang, Hsinchu, TW;
Feng-Cheng Hsu, New Taipei, TW;
Shuo-Mao Chen, New Taipei, TW;
Techi Wong, Hsinchu County, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
A chip package is provided. The chip package includes a substrate structure. The substrate structure includes a redistribution structure having a conductive pad. The substrate structure includes a first insulating layer under the redistribution structure. The substrate structure includes a conductive via structure passing through the first insulating layer. The conductive via structure is under and electrically connected with the conductive pad. The substrate structure includes a second insulating layer disposed between the redistribution structure and the first insulating layer. The chip package includes a first chip over the redistribution structure and electrically connected to the conductive via structure through the redistribution structure. The chip package includes a second chip under the substrate structure.