The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2024

Filed:

Mar. 25, 2022
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Meng-Hsien Li, Hsinchu, TW;

Ying-Chuen Wang, Taichung, TW;

Chieh-Yi Shen, Taipei, TW;

Li-Min Chen, Hsinchu County, TW;

Ming-Hsi Yeh, Hsinchu, TW;

Kuo-Bin Huang, Hsinchu County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/306 (2006.01); C09K 13/00 (2006.01); C23F 1/00 (2006.01); C23F 1/10 (2006.01); H01L 21/308 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/30608 (2013.01); C09K 13/00 (2013.01); C23F 1/00 (2013.01); C23F 1/10 (2013.01); H01L 21/3081 (2013.01); H01L 21/3083 (2013.01); H01L 21/76813 (2013.01); H01L 21/76829 (2013.01);
Abstract

A wet etching chemistry to selectively remove a polymer residue on an opening embedded in a low-k dielectric layer and an underlying stop layer in a process of forming an interconnect structure is provided. The wet etching chemistry includes: two type of organic solvents, wherein a concentration of the two type of organic solvents is greater than or equal to 70%; an Alkali source amine, at least comprising a tertiary amine; an inhibitor; and water. In some embodiment, the wet etching chemistry is free of a peroxide to avoid damage to the WdC hard mask.


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