The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2024

Filed:

Jun. 26, 2020
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Cory Bomberger, Portland, OR (US);

Suresh Vishwanath, Portland, OR (US);

Yulia Tolstova, Hillsboro, OR (US);

Pratik Patel, Portland, OR (US);

Szuya S. Liao, Portland, OR (US);

Anand S. Murthy, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/02 (2006.01); H01L 21/28 (2006.01); H01L 21/3215 (2006.01); H01L 29/06 (2006.01); H01L 29/08 (2006.01); H01L 29/423 (2006.01); H01L 29/49 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76834 (2013.01); H01L 21/02532 (2013.01); H01L 21/28255 (2013.01); H01L 21/3215 (2013.01); H01L 21/76831 (2013.01); H01L 29/0676 (2013.01); H01L 29/0847 (2013.01); H01L 29/4236 (2013.01); H01L 29/4916 (2013.01); H01L 29/6656 (2013.01); H01L 29/66628 (2013.01);
Abstract

Integrated circuit structures having source or drain structures with a high germanium concentration capping layer are described. In an example, an integrated circuit structure includes source or drain structures including an epitaxial structure embedded in a fin at a side of a gate stack. The epitaxial structure has a lower semiconductor layer and a capping semiconductor layer on the lower semiconductor layer with an abrupt interface between the capping semiconductor layer and the lower semiconductor layer. The lower semiconductor layer includes silicon, germanium and boron, the germanium having an atomic concentration of less than 40% at the abrupt interface. The capping semiconductor layer includes silicon, germanium and boron, the germanium having an atomic concentration of greater than 50% at the abrupt interface and throughout the capping semiconductor layer.


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