The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2024

Filed:

Feb. 06, 2023
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Yu-Chang Lin, Hsinchu, TW;

Chun-Feng Nieh, Hsinchu, TW;

Huicheng Chang, Tainan, TW;

Hou-Yu Chen, Zhubei, TW;

Yong-Yan Lu, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/092 (2006.01); H01L 21/02 (2006.01); H01L 21/265 (2006.01); H01L 21/8234 (2006.01); H01L 21/8238 (2006.01); H01L 21/84 (2006.01); H01L 27/12 (2006.01); H01L 29/165 (2006.01); H01L 29/49 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0924 (2013.01); H01L 21/02529 (2013.01); H01L 21/02532 (2013.01); H01L 21/0262 (2013.01); H01L 21/26513 (2013.01); H01L 21/2658 (2013.01); H01L 21/26586 (2013.01); H01L 21/26593 (2013.01); H01L 21/823418 (2013.01); H01L 21/823431 (2013.01); H01L 21/823814 (2013.01); H01L 21/823821 (2013.01); H01L 21/823878 (2013.01); H01L 21/845 (2013.01); H01L 27/1211 (2013.01); H01L 29/495 (2013.01); H01L 29/4966 (2013.01); H01L 29/4975 (2013.01); H01L 29/66545 (2013.01); H01L 29/6656 (2013.01); H01L 29/66795 (2013.01); H01L 29/66803 (2013.01); H01L 29/6681 (2013.01); H01L 29/7842 (2013.01); H01L 29/7846 (2013.01); H01L 29/7848 (2013.01); H01L 29/785 (2013.01); H01L 29/7851 (2013.01); H01L 29/7855 (2013.01); H01L 21/823412 (2013.01); H01L 21/823807 (2013.01); H01L 29/165 (2013.01);
Abstract

A semiconductor device includes a substrate, a fin structure and an isolation layer formed on the substrate and adjacent to the fin structure. The semiconductor device includes a gate structure formed on at least a portion of the fin structure and the isolation layer. The semiconductor device includes an epitaxial layer including a strained material that provides stress to a channel region of the fin structure. The epitaxial layer has a first region and a second region, in which the first region has a first doping concentration of a first doping agent and the second region has a second doping concentration of a second doping agent. The first doping concentration is greater than the second doping concentration. The epitaxial layer is doped by ion implantation using phosphorous dimer.


Find Patent Forward Citations

Loading…