logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12014928 B1

PDFFull Text
Date of Patent:
Jun. 18, 2024

Filed:

Jul. 31, 2019

Multi-layer feature fill

Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

Xiaolan Ba, San Jose, CA (US);

Ruopeng Deng, San Jose, CA (US);

Juwen Gao, San Jose, CA (US);

Sanjay Gopinath, Fremont, CA (US);

Lawrence Schloss, Palo Alto, CA (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:

Weaver Austin Villeneuve & Sampson LLP

Primary Examiner:

Asok K Sarkar

Int. Cl.
CPC ...
H01L 21/285 (2006.01); C23C 10/04 (2006.01); C23C 16/04 (2006.01); C23C 16/14 (2006.01); C23C 16/455 (2006.01); H01L 21/768 (2006.01); H01L 23/532 (2006.01); H10B 41/27 (2023.01); H10B 43/27 (2023.01);
U.S. Cl.
CPC ...
H01L 21/28568 (2013.01); C23C 16/045 (2013.01); C23C 16/14 (2013.01); C23C 16/45527 (2013.01); C23C 16/45544 (2013.01); H01L 21/76805 (2013.01); H01L 21/76895 (2013.01); H01L 23/53209 (2013.01); H01L 23/53242 (2013.01); H01L 23/53257 (2013.01); H10B 41/27 (2023.02); H10B 43/27 (2023.02);
Abstract

Described herein are methods and apparatuses for filling semiconductor substrate structures with conductive material. The methods involve depositing multi-layer bulk metal films in structures with one or more deposition conditions changed when transitioning from layer-to-layer. The methods result in high fill quality, high throughput, low precursor consumption, and low roughness. Multi-station chambers to perform the methods are also provided.

Find Patent Forward Citations

Quick Actions:

Ba, Xiaolan. (2024). Multi-layer feature fill (U.S. Patent No. 12014928). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12014928

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…