The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 28, 2024

Filed:

Dec. 14, 2022
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Tejinder Singh, San Jose, CA (US);

Lifan Yan, San Jose, CA (US);

Abhijit B. Mallick, Fremont, CA (US);

Daniel Lee Diehl, Chiba, JP;

Ho-yung Hwang, Cupertino, CA (US);

Jothilingam Ramalingam, Milpitas, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/09 (2006.01); G03F 7/20 (2006.01); H01L 21/027 (2006.01); H01L 21/033 (2006.01); H01L 21/308 (2006.01);
U.S. Cl.
CPC ...
G03F 7/094 (2013.01); H01L 21/0274 (2013.01); H01L 21/0332 (2013.01); H01L 21/3081 (2013.01); G03F 7/20 (2013.01);
Abstract

Embodiments of the present disclosure generally relate to a multilayer stack used as a mask in extreme ultraviolet (EUV) lithography and methods for forming a multilayer stack. In one embodiment, the method includes forming a carbon layer over a film stack, forming a metal rich oxide layer on the carbon layer by a physical vapor deposition (PVD) process, forming a metal oxide photoresist layer on the metal rich oxide layer, and patterning the metal oxide photoresist layer. The metal oxide photoresist layer is different from the metal rich oxide layer and is formed by a process different from the PVD process. The metal rich oxide layer formed by the PVD process improves adhesion of the metal oxide photoresist layer and increases the secondary electrons during EUV lithography, which leads to decreased EUV dose energies.


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