The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2024
Filed:
Dec. 21, 2022
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Fong-Yuan Chang, Hsinchu County, TW;
Kuo-Nan Yang, Hsinchu, TW;
Chung-Hsing Wang, Hsinchu County, TW;
Lee-Chung Lu, Taipei, TW;
Sheng-Fong Chen, Hsinchu County, TW;
Po-Hsiang Huang, Tainan, TW;
Hiranmay Biswas, Kolkata, IN;
Sheng-Hsiung Chen, Hsinchu County, TW;
Aftab Alam Khan, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Abstract
An integrated circuit includes a cell layer including a first cell and a second cell, a first metal layer over the cell layer and having a first conductive feature, a second metal layer over the first metal layer and having a second conductive feature, and a first via between the first metal layer and the second metal layer and connecting the first conductive feature to the second conductive feature. The first conductive feature spans over a boundary between the first and second cells, and has a lengthwise direction along a first direction. The second conductive feature spans over the boundary between the first and second cells, and has a lengthwise direction along a second direction that is perpendicular to the first direction.