The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2024

Filed:

Mar. 27, 2020
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Robert L. Sankman, Phoenix, AZ (US);

Rahul N. Manepalli, Chandler, AZ (US);

Robert Alan May, Chandler, AZ (US);

Srinivas Venkata Ramanuja Pietambaram, Chandler, AZ (US);

Bharat P. Penmecha, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/15 (2006.01); H01L 25/065 (2023.01); H01L 21/48 (2006.01); H01L 23/538 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/15 (2013.01); H01L 21/486 (2013.01); H01L 23/3128 (2013.01); H01L 23/5381 (2013.01); H01L 23/5384 (2013.01); H01L 25/0655 (2013.01);
Abstract

Various examples provide a semiconductor patch. The patch includes a glass core having first and second opposed major surfaces extending in an x-y direction. The patch further includes a conductive via extending from the first major surface to the second major surface substantially in a z-direction. The patch further includes a bridge die embedded in a dielectric material in communication with the conductive via. The patch further includes an overmold at least partially encasing the glass core.


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