The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2024
Filed:
Feb. 17, 2021
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Hung-Ling Shih, Tainan, TW;
Wei Chuang Wu, Tainan, TW;
Shih Kuang Yang, Tainan, TW;
Hsing-Chih Lin, Tainan, TW;
Jen-Cheng Liu, Hsin-Chu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
The present disclosure relates an integrated chip. The integrated chip includes a semiconductor device arranged along a first side of a semiconductor substrate. The semiconductor substrate has one or more sidewalls extending from the first side of the semiconductor substrate to an opposing second side of the semiconductor substrate. A dielectric liner lines the one or more sidewalls of the semiconductor substrate. A through-substrate-via (TSV) is arranged between the one or more sidewalls and is separated from the semiconductor substrate by the dielectric liner. The TSV has a first width at a first distance from the second side and a second width at a second distance from the second side. The first width is smaller than the second width and the first distance is smaller than the second distance.