The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2024
Filed:
May. 04, 2022
Applicant:
Globalwafers Co., Ltd., Hsinchu, TW;
Inventors:
Shang-Chi Wang, Hsinchu, TW;
Wen-Ching Hsu, Hsinchu, TW;
Chia-Chi Tsai, Hsinchu, TW;
I-Ching Li, Hsinchu, TW;
Assignee:
GlobalWafers Co., Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 23/00 (2006.01); G01B 15/04 (2006.01); G01N 23/20 (2018.01);
U.S. Cl.
CPC ...
G01B 15/04 (2013.01); G01N 23/20 (2013.01); G01N 2223/056 (2013.01);
Abstract
A material analysis method is provided. A plurality of wafers processed from a plurality of ingots are measured by a measuring instrument to obtain an average of a bow of each of the wafers processed from the ingots and a plurality of full widths at half maximum (FWHM) of each of the wafers. Key factors respectively corresponding to the ingots are calculated according to the FWHM of the wafers. A regression equation is obtained according to the key factors and the average of the bows.