The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 19, 2023
Filed:
Aug. 09, 2022
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Yu-Chia Lai, Zhunan Township, TW;
Kuo Lung Pan, Hsinchu, TW;
Hung-Yi Kuo, Taipei, TW;
Tin-Hao Kuo, Hsinchu, TW;
Hao-Yi Tsai, Hsinchu, TW;
Chung-Shi Liu, Hsinchu, TW;
Chen-Hua Yu, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD, Hsinchu, TW;
Abstract
A semiconductor package includes a first die; a first redistribution structure over the first die, the first redistribution structure being conterminous with the first die; a second die over the first die, a first portion of the first die extending beyond a lateral extent of the second die; a conductive pillar over the first portion of the first die and laterally adjacent to the second die, the conductive pillar electrically coupled to first die; a molding material around the first die, the second die, and the conductive pillar; and a second redistribution structure over the molding material, the second redistribution structure electrically coupled to the conductive pillar and the second die.