The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2023
Filed:
Apr. 06, 2022
Western Digital Technologies, Inc., San Jose, CA (US);
John Patrick Burke, San Jose, CA (US);
Ibrahym bin Ahmad, Parit Buntar, MY;
Fakhrozi Bin Che Ani, Bukit Mertajam, MY;
Mohamad Solehin Bin Mohamed Sunar, Bagan Serai, MY;
Peir Ming Sing, Bukit Mertajam, MY;
Hari Kiran Raavi, Dublin, CA (US);
Western Digital Technologies, Inc., San Jose, CA (US);
Abstract
Micro solder joint and stencil design. In one embodiment, a stencil for depositing solder on a printed circuit board (PCB) includes a plurality of stencil apertures, a first stencil aperture of the plurality of apertures having an aperture wall defining an aperture perimeter. The aperture wall is configured to not extend beyond an outer edge of a PCB pad provided on the printed circuit board, the aperture wall is also configured to not extend beyond an outer edge of a terminal of a surface mount component, and the first stencil aperture is configured to receive solder paste to form a non-convex solder joint between the PCB pad and the terminal.