Fakhrozi Bin Che Ani

Title: Fakhrozi Bin Che Ani: Innovator in Micro Solder Joint Technology

Introduction

Fakhrozi Bin Che Ani is a notable inventor based in Bukit Mertajam, Malaysia. He has made significant contributions to the field of electronics, particularly in the design of micro solder joints. His innovative approach has led to the development of a unique patent that enhances the efficiency of soldering processes in printed circuit boards.

Latest Patents

Fakhrozi holds a patent for a "Micro solder joint and stencil aperture design." This invention includes a stencil for depositing solder on a printed circuit board (PCB) that features multiple stencil apertures. Notably, the first stencil aperture is designed with an aperture wall that does not extend beyond the outer edge of a PCB pad or the terminal of a surface mount component. This design allows for the formation of a non-convex solder joint between the PCB pad and the terminal, improving the overall soldering process.

Career Highlights

Fakhrozi is currently employed at Western Digital Technologies, Inc., where he applies his expertise in electronics and soldering technology. His work has been instrumental in advancing the company's capabilities in producing high-quality electronic components.

Collaborations

Fakhrozi has collaborated with several talented individuals in his field, including John Patrick Burke and Ibrahym Bin Ahmad. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Fakhrozi Bin Che Ani is a distinguished inventor whose work in micro solder joint technology has made a significant impact in the electronics industry. His innovative designs and collaborative spirit continue to drive advancements in the field.