Dublin, CA, United States of America

Hari Kiran Raavi

USPTO Granted Patents = 1 

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: **Innovative Contributions of Hari Kiran Raavi in Micro Solder Joint Technology**

Introduction

Hari Kiran Raavi, a talented inventor based in Dublin, California, has made a noteworthy contribution to the field of electronics with his innovation in micro solder joint technology. With a patent in hand, he continues to showcase his ingenuity as part of his professional endeavors.

Latest Patents

Raavi holds a patent for a “Micro solder joint and stencil aperture design,” which focuses on improving the performance of printed circuit boards (PCBs). The patent describes a stencil for depositing solder that features multiple stencil apertures designed precisely for optimal solder application. His innovative design ensures that the aperture wall does not exceed the edges of PCB pads or surface mount component terminals, thus allowing for the formation of non-convex solder joints. This advancement has significant implications for the efficiency and reliability of electronic devices.

Career Highlights

Currently, Hari Kiran Raavi is employed at Western Digital Technologies, Inc., where he applies his expertise in electronics and soldering technology. His work contributes to the development and refinement of cutting-edge technologies essential for data storage solutions. Raavi's patent reflects his commitment to enhancing electronic manufacturing processes and demonstrates his potential as a leading innovator in his field.

Collaborations

Throughout his career, Raavi has collaborated with notable colleagues, including John Patrick Burke and Ibrahym bin Ahmad. These partnerships underline the collaborative spirit within the industry and highlight the importance of teamwork in fostering innovative developments.

Conclusion

In conclusion, Hari Kiran Raavi's inventive contributions, specifically in developing a micro solder joint and stencil aperture design, are a testament to his skills and creativity as an inventor. His work not only enhances the quality of electronic manufacturing but also places him among the noteworthy figures in the technology sector. As he continues to innovate, his future endeavors are likely to yield even more advancements beneficial to the electronics industry.

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