Peir Ming Sing

Title: Peir Ming Sing: Innovator in Micro Solder Joint Technology

Introduction

Peir Ming Sing is a notable inventor based in Bukit Mertajam, Malaysia. He has made significant contributions to the field of electronics, particularly in the design of micro solder joints. His innovative approach has led to the development of a unique patent that enhances the efficiency of soldering processes in printed circuit boards.

Latest Patents

Peir Ming Sing holds a patent for a "Micro solder joint and stencil aperture design." This invention involves a stencil for depositing solder on a printed circuit board (PCB) that includes multiple stencil apertures. The first stencil aperture is designed with an aperture wall that does not extend beyond the outer edge of a PCB pad or the terminal of a surface mount component. This design allows for the formation of a non-convex solder joint between the PCB pad and the terminal, improving the reliability of electronic connections. He has 1 patent to his name.

Career Highlights

Peir Ming Sing is currently employed at Western Digital Technologies, Inc., where he applies his expertise in solder joint technology. His work focuses on enhancing the manufacturing processes of electronic components, contributing to the overall quality and performance of products in the industry.

Collaborations

Throughout his career, Peir Ming Sing has collaborated with talented individuals such as John Patrick Burke and Ibrahym Bin Ahmad. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Peir Ming Sing is a distinguished inventor whose work in micro solder joint technology has made a significant impact in the electronics field. His innovative designs and collaborations continue to drive advancements in manufacturing processes.