Company Filing History:
Years Active: 2023
Title: Ibrahym Bin Ahmad: Innovator in Micro Solder Joint Technology
Introduction
Ibrahym Bin Ahmad is a notable inventor based in Parit Buntar, Malaysia. He has made significant contributions to the field of electronics through his innovative designs and patents. His work primarily focuses on improving solder joint technology, which is crucial for the manufacturing of printed circuit boards (PCBs).
Latest Patents
Ibrahym holds a patent for a "Micro solder joint and stencil aperture design." This invention involves a stencil for depositing solder on a PCB, featuring a plurality of stencil apertures. The first stencil aperture is designed to ensure that the aperture wall does not extend beyond the outer edge of a PCB pad or a terminal of a surface mount component. This design allows for the formation of a non-convex solder joint between the PCB pad and the terminal, enhancing the reliability of electronic connections.
Career Highlights
Ibrahym is currently employed at Western Digital Technologies, Inc., where he applies his expertise in solder joint technology. His role involves collaborating with other engineers and contributing to the development of advanced electronic components. His innovative approach has positioned him as a valuable asset in his field.
Collaborations
Ibrahym has worked alongside talented colleagues, including John Patrick Burke and Fakhrozi Bin Che Ani. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.
Conclusion
Ibrahym Bin Ahmad's contributions to micro solder joint technology exemplify the impact of innovation in the electronics industry. His patent and work at Western Digital Technologies, Inc. highlight his commitment to advancing technology and improving electronic manufacturing processes.