Western Digital Technologies, Inc.

Ibrahym Bin Ahmad

John Patrick Burke

Hari Kiran Raavi

Mohamad Solehin Bin Mohamed Sunar

Fakhrozi Bin Che Ani

Peir Ming Sing

Micro solder joint and stencil design. In one embodiment, a stencil for depositing solder on a printed circuit board (PCB) includes a plurality of stencil apertures, a first stencil aperture of the plurality of apertures having an aperture wall defining an aperture perimeter. The aperture wall is configured to not extend beyond an outer edge of a PCB pad provided on the printed circuit board, the aperture wall is also configured to not extend beyond an outer edge of a terminal of a surface mount component, and the first stencil aperture is configured to receive solder paste to form a non-convex solder joint between the PCB pad and the terminal.

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Parit Buntar, Malaysia

Ibrahym Bin Ahmad