The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2023
Filed:
Jun. 30, 2021
Applicant:
Dongjin Semichem Co., Ltd., Incheon, KR;
Inventors:
Weoun Gyuen Moon, Hwaseong-si, KR;
Jae Hyun Kim, Hwaseong-si, KR;
Kyu Soon Shin, Hwaseong-si, KR;
Jong Dai Park, Hwaseong-si, KR;
Min Gun Lee, Hwaseong-si, KR;
Sung Hoon Jin, Hwaseong-si, KR;
Goo Hwa Lee, Hwaseong-si, KR;
Gyeong Sook Cho, Hwaseong-si, KR;
Jae Hong Yoo, Hwaseong-si, KR;
Assignee:
Dongjin Semichem Co., Ltd., Incheon, KR;
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); C09K 3/14 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); C09K 3/1436 (2013.01);
Abstract
The present disclosure provides chemical-mechanical polishing (CMP) particles exhibiting a high polishing rate and a high polishing quality of generating few defects or scratches due to their modified surface thereof. The present disclosure also provides a polishing slurry composition including the polishing particles.