The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2023

Filed:

Mar. 12, 2019
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Fong-Yuan Chang, Hsinchu, TW;

Chin-Chou Liu, Jhubei, TW;

Hui-Zhong Zhuang, Kaohsiung, TW;

Meng-Kai Hsu, Xinfeng Township, TW;

Pin-Dai Sue, Tainan, TW;

Po-Hsiang Huang, Tainan, TW;

Yi-Kan Cheng, Taipei, TW;

Chi-Yu Lu, New Taipei, TW;

Jung-Chou Tsai, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 30/398 (2020.01); G06F 30/392 (2020.01); G06F 30/394 (2020.01); G06F 119/18 (2020.01);
U.S. Cl.
CPC ...
G06F 30/398 (2020.01); G06F 30/392 (2020.01); G06F 30/394 (2020.01); G06F 2119/18 (2020.01);
Abstract

A method (of generating a layout diagram of a wire routing arrangement in a multi-patterning context having multiple masks, the layout diagram being stored on a non-transitory computer-readable medium) includes: placing, relative to a given one of the masks, a given cut pattern at a first candidate location over a corresponding portion of a given conductive pattern in a metallization layer; determining whether the first candidate location results in at least one of a non-circular group or a cyclic group which violates a design rule; and temporarily preventing, if there is a violation, placement of the given cut pattern in the metallization layer at the first candidate location until a correction is made which avoids violating the design rule.


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