The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 12, 2023

Filed:

Mar. 12, 2021
Applicant:

Globalwafers Co., Ltd., Hsinchu, TW;

Inventors:

Zheng Lu, O'Fallon, MO (US);

Gaurab Samanta, St. Peters, MO (US);

Tse-Wei Lu, Hsinchu, TW;

Feng-Chien Tsai, Taipei, TW;

Assignee:

GlobalWafers Co., Ltd., Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C30B 29/02 (2006.01); C30B 33/02 (2006.01); C30B 29/06 (2006.01); H01L 21/02 (2006.01); H01L 21/00 (2006.01); C30B 15/20 (2006.01);
U.S. Cl.
CPC ...
C30B 33/02 (2013.01); C30B 15/203 (2013.01); C30B 15/206 (2013.01); C30B 29/06 (2013.01); H01L 21/00 (2013.01); H01L 21/0262 (2013.01); H01L 21/02381 (2013.01); H01L 21/02532 (2013.01);
Abstract

Nitrogen-doped CZ silicon crystal ingots and wafers sliced therefrom are disclosed that provide for post epitaxial thermally treated wafers having oxygen precipitate density and size that are substantially uniformly distributed radially and exhibit the lack of a significant edge effect. Methods for producing such CZ silicon crystal ingots are also provided by controlling the pull rate from molten silicon, the temperature gradient and the nitrogen concentration. Methods for simulating the radial bulk micro defect size distribution, radial bulk micro defect density distribution and oxygen precipitation density distribution of post epitaxial thermally treated wafers sliced from nitrogen-doped CZ silicon crystals are also provided.


Find Patent Forward Citations

Loading…