The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2023
Filed:
Nov. 15, 2017
Acm Research (Shanghai) Inc., Shanghai, CN;
Hui Wang, Fremont, CA (US);
Fufa Chen, Cupertino, CA (US);
Fuping Chen, Shanghai, CN;
Jian Wang, Shanghai, CN;
Xi Wang, Shanghai, CN;
Xiaoyan Zhang, Shanghai, CN;
Yinuo Jin, Shanghai, CN;
Zhaowei Jia, Shanghai, CN;
Liangzhi Xie, Shanghai, CN;
Jun Wang, Shanghai, CN;
Xuejun Li, Shanghai, CN;
ACM Research (Shanghai) Inc., Shanghai, CN;
Abstract
A method for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the method comprising: delivering a cleaning liquid over a surface of a semiconductor wafer during a cleaning process; and imparting sonic energy to the cleaning liquid from a sonic transducer during the cleaning process, wherein power is alternately supplied to the sonic transducer at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, the first predetermined period of time and the second predetermined period of time consecutively following one another, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.