The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 2023
Filed:
Feb. 27, 2019
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Omkar Karhade, Chandler, AZ (US);
Mitul Modi, Phoenix, AZ (US);
Edvin Cetegen, Chandler, AZ (US);
Aastha Uppal, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/46 (2006.01); F28D 15/02 (2006.01); H01L 21/48 (2006.01); H01L 23/427 (2006.01);
U.S. Cl.
CPC ...
H01L 23/46 (2013.01); F28D 15/02 (2013.01); H01L 21/4882 (2013.01); H01L 23/427 (2013.01);
Abstract
Package assemblies with a molded substrate comprising fluid conduits. The fluid conduits may be operable for conveying a fluid (e.g., liquid and/or vapor) through some portion of the package substrate structure. Fluid conduits may be at least partially defined by an interconnect trace comprising a metal. The fluid conveyance may improve thermal management of the package assembly, for example removing heat dissipated by one or more integrated circuits (ICs) of the package assembly.