The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 06, 2023

Filed:

Jan. 09, 2019
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Christopher Jezewski, Portland, OR (US);

Ashish Agrawal, Hillsboro, OR (US);

Kevin L. Lin, Beaverton, OR (US);

Abhishek Sharma, Hillsboro, OR (US);

Carl Naylor, Hillsboro, OR (US);

Urusa Alaan, Hillsboro, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 23/522 (2006.01); H01L 27/12 (2006.01); H01L 29/417 (2006.01); H01L 29/24 (2006.01); H01L 29/423 (2006.01); H01L 29/786 (2006.01); H01L 23/535 (2006.01); H01L 21/768 (2006.01); H01L 29/66 (2006.01); H01L 21/02 (2006.01); H01L 21/4763 (2006.01);
U.S. Cl.
CPC ...
H01L 23/528 (2013.01); H01L 21/02568 (2013.01); H01L 21/47635 (2013.01); H01L 21/76802 (2013.01); H01L 23/5226 (2013.01); H01L 23/535 (2013.01); H01L 27/124 (2013.01); H01L 27/1222 (2013.01); H01L 27/1259 (2013.01); H01L 29/24 (2013.01); H01L 29/41733 (2013.01); H01L 29/42392 (2013.01); H01L 29/66969 (2013.01); H01L 29/78642 (2013.01); G05B 2219/1163 (2013.01);
Abstract

Integrated circuits including selectable vias are disclosed. The techniques are particularly well-suited to back end of line (BEOL) processes. In accordance with some embodiments, a selectable via includes a vertically-oriented thin film transistor structure having a wrap around gate, which can be used to effectively select (or deselect) the selectable via ad hoc. When a selectable via is selected, a signal is allowed to pass through the selectable via. Conversely, when the selectable via is not selected, a signal is not allowed to pass through the selectable via. The selectable characteristic of the selectable via allows multiple vias to share a global interconnect. The global interconnect can be connected to any number of selectable vias, as well as standard vias.


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