The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 06, 2023

Filed:

Jul. 12, 2021
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Jun Shinagawa, Fremont, CA (US);

Toshihiro Kitao, Austin, TX (US);

Hiroshi Nagahata, Miyagi, JP;

Chungjong Lee, Miyagi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G05B 19/418 (2006.01); H01L 21/66 (2006.01); H05H 1/46 (2006.01);
U.S. Cl.
CPC ...
G05B 19/41875 (2013.01); H01L 22/12 (2013.01); H05H 1/46 (2013.01); G05B 2219/45031 (2013.01);
Abstract

A method of evaluating tool health of a plasma tool is provided. The method includes providing a virtual metrology (VM) model that predicts a wafer characteristic based on parameters measured by module sensors and in-situ sensors of the plasma tool. A classification model is provided that identifies a plurality of failure modes of the plasma tool. An initial test is performed on an incoming wafer to determine whether the incoming wafer meets a preset requirement. The wafer characteristic is predicted using the VM model when the incoming wafer meets the preset requirement. A current failure mode is identified using the classification model when the wafer characteristic predicted by using the VM model is outside a pre-determined range.


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