The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 2023

Filed:

Jul. 22, 2021
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Eric Miller, Watervliet, NY (US);

Marc A. Bergendahl, Rensselaer, NY (US);

Kangguo Cheng, Schenectady, NY (US);

Sean Teehan, Rensselaer, NY (US);

John Sporre, Albany, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8234 (2006.01); H01L 29/08 (2006.01); H01L 29/66 (2006.01); H01L 29/10 (2006.01); H01L 21/02 (2006.01); H01L 29/78 (2006.01); H01L 27/088 (2006.01); H01L 21/762 (2006.01);
U.S. Cl.
CPC ...
H01L 21/823487 (2013.01); H01L 21/02532 (2013.01); H01L 21/02592 (2013.01); H01L 21/823412 (2013.01); H01L 21/823437 (2013.01); H01L 21/823468 (2013.01); H01L 21/823481 (2013.01); H01L 27/088 (2013.01); H01L 29/0847 (2013.01); H01L 29/1037 (2013.01); H01L 29/6653 (2013.01); H01L 29/6656 (2013.01); H01L 29/66666 (2013.01); H01L 29/7827 (2013.01); H01L 21/76224 (2013.01);
Abstract

Embodiments of the present invention are directed to fabrication method and resulting structures for vertical tunneling field effect transistors (VFETs) having a dual liner bottom spacer. In a non-limiting embodiment of the invention, a first liner is formed on a top surface of a source or drain (S/D) region and sidewalls of a semiconductor fin. Portions of a spacer are removed to expose a first region and a second region of the first liner. The first region of the first liner is directly on the S/D region and the second region is over the semiconductor fin. A second liner is formed on the first liner. A first portion of the second liner is formed by selectively depositing dielectric material on the exposed first region and exposed second region of the first liner. The first liner and the second liner collectively define the dual liner bottom spacer.


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