The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 11, 2023

Filed:

Aug. 09, 2021
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Hongbin Zhu, Boise, ID (US);

Zhenyu Lu, Boise, ID (US);

Gordon Haller, Boise, ID (US);

Jie Sun, Boise, ID (US);

Randy J. Koval, Boise, ID (US);

John Hopkins, Meridian, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/11582 (2017.01); H01L 27/11556 (2017.01); H01L 29/10 (2006.01); H01L 29/51 (2006.01); H01L 27/1157 (2017.01); H01L 21/28 (2006.01); H01L 29/66 (2006.01); H01L 29/792 (2006.01); H01L 27/11563 (2017.01);
U.S. Cl.
CPC ...
H01L 27/11582 (2013.01); H01L 27/1157 (2013.01); H01L 27/11556 (2013.01); H01L 27/11563 (2013.01); H01L 29/1037 (2013.01); H01L 29/40114 (2019.08); H01L 29/513 (2013.01); H01L 29/66825 (2013.01); H01L 29/66833 (2013.01); H01L 29/7926 (2013.01);
Abstract

Some embodiments include a semiconductor device having a stack structure including a source comprising polysilicon, an etch stop of oxide on the source, a select gate source on the etch stop, a charge storage structure over the select gate source, and a select gate drain over the charge storage structure. The semiconductor device may further include an opening extending vertically into the stack structure to a level adjacent to the source. A channel comprising polysilicon may be formed on a side surface and a bottom surface of the opening. The channel may contact the source at a lower portion of the opening, and may be laterally separated from the charge storage structure by a tunnel oxide. A width of the channel adjacent to the select gate source is greater than a width of the channel adjacent to the select gate drain.


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