The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 14, 2023
Filed:
Mar. 30, 2021
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Shu-Wei Li, Hsinchu, TW;
Guanyu Luo, Hsinchu, TW;
Shin-Yi Yang, New Taipei, TW;
Ming-Han Lee, Taipei, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
An interconnection structure, along with methods of forming such, are described. The structure includes a dielectric material and a conductive feature extending through the dielectric material. The conductive feature includes a conductive material and has a first top surface. The structure further includes a dummy conductive feature disposed adjacent the conductive feature in the dielectric material, and the dummy conductive feature has a second top surface substantially co-planar with the first top surface. An air gap is formed in the dummy conductive feature.