The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2023
Filed:
Apr. 12, 2021
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Shih-Chang Ku, Taipei, TW;
Hung-Chi Li, Taipei, TW;
Tsung-Shu Lin, New Taipei, TW;
Tsung-Yu Chen, Hsinchu, TW;
Wensen Hung, Zhubei, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY. LTD., Hsinchu, TW;
Abstract
A semiconductor device includes a vapor chamber lid for high power applications such as chip-on-wafer-on-substrate (CoWoS) applications using high performance processors (e.g., graphics processing unit (GPU)) and methods of manufacturing the same. The vapor chamber lid provides a thermal solution which enhances the thermal performance of a package with multiple chips. The vapor chamber lid improves hot spot dissipation in high performance chips, for example, at the three-dimensional (3D-IC) packaging level.