The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 03, 2023

Filed:

Mar. 04, 2020
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Kuniaki Yamaguchi, Tokyo, JP;

Hiroshi Shimomoto, Tokyo, JP;

Soichi Isobe, Tokyo, JP;

Koji Maeda, Tokyo, JP;

Kenji Shinkai, Tokyo, JP;

Hidetatsu Isokawa, Tokyo, JP;

Dai Yoshinari, Tokyo, JP;

Masayuki Tamura, Tokyo, JP;

Haiyang Xu, Tokyo, JP;

Shun Ehara, Tokyo, JP;

Kentaro Asano, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 49/00 (2012.01); B24B 37/015 (2012.01); B24B 53/00 (2006.01); B24B 57/02 (2006.01); B24B 53/017 (2012.01);
U.S. Cl.
CPC ...
B24B 37/015 (2013.01); B24B 53/005 (2013.01); B24B 57/02 (2013.01); B24B 53/017 (2013.01);
Abstract

A substrate processing apparatus includes a polishing section and a transport section. The polishing section has a first polishing unit, a second polishing unit, and a transport mechanism. The first polishing unit has a first polishing apparatus and a second polishing apparatus. The second polishing unit has a third polishing apparatus and a fourth polishing apparatus. Each of the first to fourth polishing apparatuses has a polishing table to which a polishing pad is mounted, a top ring, and auxiliary units that perform a process on the polishing pad during polishing. Around the polishing table, a pair of auxiliary unit mounting units for mounting the respective auxiliary units in a left-right switchable manner with respect to a straight line connecting a swing center of the top ring and a center of rotation of the polishing table is provided at respective positions symmetrical with respect to the straight line.


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