The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 22, 2022
Filed:
May. 12, 2021
Applicant:
Fujifilm Electronic Materials U.s.a., Inc, North Kingstown, RI (US);
Inventors:
David (Tawei) Lin, Chandler, AZ (US);
Bin Hu, Chandler, AZ (US);
Liqing (Richard) Wen, Mesa, AZ (US);
Yannan Liang, Gilbert, AZ (US);
Ting-Kai Huang, Taiwan, CN;
Assignee:
FUJIFILM ELECTRONIC MATERIALS U.S.A., INC., Kingstown, RI (US);
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); H01L 21/321 (2006.01); C09K 3/14 (2006.01); C09G 1/06 (2006.01); C09K 13/06 (2006.01); C09G 1/04 (2006.01); B24B 1/00 (2006.01); C09G 1/00 (2006.01); B24B 37/04 (2012.01); H01L 21/306 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); B24B 1/00 (2013.01); B24B 37/044 (2013.01); C09G 1/00 (2013.01); C09G 1/04 (2013.01); C09G 1/06 (2013.01); C09K 3/1454 (2013.01); C09K 3/1463 (2013.01); C09K 13/06 (2013.01); H01L 21/30625 (2013.01); H01L 21/3212 (2013.01);
Abstract
A slurry for polishing surfaces or substrates that at least partially comprise ruthenium and copper, wherein the slurry includes an alkali hydroxide, oxygenated halogen compound, and a halogen alkyl benzotriazole. The slurry may further include abrasive, acid(s), and, optionally, an alkoxylated alcohol. With these components, the slurry exhibits a high ruthenium to copper removal rate ratio.