The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 08, 2022

Filed:

Dec. 16, 2020
Applicant:

Cmc Materials, Inc., Aurora, IL (US);

Inventors:

Na Zhang, Naperville, IL (US);

David Bailey, Victor, NY (US);

Kevin P. Dockery, Aurora, IL (US);

Roman A. Ivanov, Aurora, IL (US);

Deepak Shukla, Webster, NY (US);

Assignee:

CMC Materials, Inc., Aurora, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); C08G 69/48 (2006.01); H01L 21/3105 (2006.01); H01L 21/321 (2006.01); C09G 1/04 (2006.01); C09G 1/06 (2006.01); B24B 1/00 (2006.01); B24B 37/04 (2012.01); C09K 3/14 (2006.01); C09G 1/00 (2006.01); H01L 21/306 (2006.01); C09K 13/06 (2006.01); C08G 69/10 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); B24B 1/00 (2013.01); B24B 37/044 (2013.01); C08G 69/48 (2013.01); C09G 1/00 (2013.01); C09G 1/04 (2013.01); C09G 1/06 (2013.01); C09K 3/1454 (2013.01); C09K 3/1463 (2013.01); C09K 13/06 (2013.01); H01L 21/30625 (2013.01); H01L 21/31053 (2013.01); H01L 21/3212 (2013.01); C08G 69/10 (2013.01);
Abstract

A composition comprises, consists of, or consists essentially of a polymer including a derivatized amino acid monomer unit. A chemical mechanical polishing composition includes a water based liquid carrier, abrasive particles dispersed in the liquid carrier, and a cationic polymer having a derivatized amino acid monomer unit. A method of chemical mechanical polishing includes utilizing the chemical mechanical polishing composition to remove at least a portion of a metal or dielectric layer from a substrate and thereby polish the substrate.


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