The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 2022
Filed:
Nov. 20, 2020
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Guanyu Luo, Hsinchu, TW;
Shin-Yi Yang, New Taipei, TW;
Ming-Han Lee, Taipei, TW;
Shau-Lin Shue, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
A method includes receiving an integrated circuit (IC) layout having a plurality of metal features in a metal layer. The method also includes classifying the plurality of metal features into a first type of metal features and a second type of metal features based on a dimensional criterion, where the first type of the metal features have dimensions greater than the second type of the metal features. The method further includes assigning to the first type of metal features a first metal material, and to the second type of metal features a second metal material, where the second metal material is different from the first metal material. The method additionally includes forming the plurality of metal features embedded within a dielectric layer, where each of the plurality of metal features have the respective assigned metal materials.