The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 2022

Filed:

Aug. 23, 2021
Applicant:

United Microelectronics Corp., Hsinchu, TW;

Inventors:

Yen-Chen Chen, Tainan, TW;

Xiao Wu, Singapore, SG;

Hai Tao Liu, Singapore, SG;

Ming Hua Du, Singapore, SG;

Shouguo Zhang, Singapore, SG;

Yao-Hung Liu, Tainan, TW;

Chin-Fu Lin, Tainan, TW;

Chun-Yuan Wu, Yunlin County, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/786 (2006.01); H01L 29/24 (2006.01); H01L 29/66 (2006.01); H01L 29/45 (2006.01); H01L 29/417 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7869 (2013.01); H01L 29/41733 (2013.01); H01L 29/45 (2013.01); H01L 29/66969 (2013.01); H01L 29/24 (2013.01);
Abstract

A semiconductor device includes an oxide semiconductor layer, disposed over a substrate. A source electrode of a metal nitride is disposed on the oxide semiconductor layer. A drain electrode of the metal nitride is disposed on the oxide semiconductor layer. A metal-nitride oxidation layer is formed on a surface of the source electrode and the drain electrode. A ratio of a thickness of the metal-nitride oxidation layer to a thickness of the drain electrode or the source electrode is equal to or less than 0.2.


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