The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 2022

Filed:

Nov. 30, 2020
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Jung-Chi Tai, Tainan, TW;

Chii-Horng Li, Zhubei, TW;

Pei-Ren Jeng, Chu-Bei, TW;

Yen-Ru Lee, Hsinchu, TW;

Yan-Ting Lin, Baoshan Township, TW;

Chih-Yun Chin, Taichung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/08 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 21/02 (2006.01); H01L 29/165 (2006.01); H01L 21/762 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0843 (2013.01); H01L 21/02532 (2013.01); H01L 21/76224 (2013.01); H01L 29/165 (2013.01); H01L 29/66545 (2013.01); H01L 29/66795 (2013.01); H01L 29/7848 (2013.01); H01L 29/7853 (2013.01);
Abstract

An embodiment is a semiconductor structure. The semiconductor structure includes a fin on a substrate. A gate structure is over the fin. A source/drain is in the fin proximate the gate structure. The source/drain includes a bottom layer, a supportive layer over the bottom layer, and a top layer over the supportive layer. The supportive layer has a different property than the bottom layer and the top layer, such as a different material, a different natural lattice constant, a different dopant concentration, and/or a different alloy percent content.


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