The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 04, 2022

Filed:

Dec. 17, 2018
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Juan G. Alzate Vinasco, Tigard, OR (US);

Abhishek A. Sharma, Hillsboro, OR (US);

Fatih Hamzaoglu, Portland, OR (US);

Bernhard Sell, Portland, OR (US);

Pei-Hua Wang, Beaverton, OR (US);

Van H. Le, Portland, OR (US);

Jack T. Kavalieros, Portland, OR (US);

Tahir Ghani, Portland, OR (US);

Chieh-Jen Ku, Hillsboro, OR (US);

Travis W. Lajoie, Forest Grove, OR (US);

Umut Arslan, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 27/108 (2006.01); H01L 29/786 (2006.01); H01L 49/02 (2006.01); H01L 29/66 (2006.01); H01L 29/49 (2006.01); H01L 29/417 (2006.01);
U.S. Cl.
CPC ...
H01L 27/10805 (2013.01); H01L 27/1085 (2013.01); H01L 27/10873 (2013.01); H01L 28/60 (2013.01); H01L 29/41741 (2013.01); H01L 29/4908 (2013.01); H01L 29/66742 (2013.01); H01L 29/78642 (2013.01);
Abstract

Embodiments herein describe techniques for a semiconductor device including a substrate oriented in a horizontal direction, and a memory cell including a transistor and a capacitor above the substrate. The transistor includes a gate electrode oriented in a vertical direction substantially orthogonal to the horizontal direction, and a channel layer oriented in the vertical direction, around the gate electrode and separated by a gate dielectric layer from the gate electrode. The capacitor is within an inter-level dielectric layer above the substrate. The capacitor includes a first plate coupled with a second portion of the channel layer of the transistor, and a second plate separated from the first plate by a capacitor dielectric layer. The first plate of the capacitor is also a source electrode of the transistor. Other embodiments may be described and/or claimed.


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